发明名称 SAW DEVICE HAVING HERMETICALLY SEALED SAW CHIP AND FABRICATING METHOD THEREOF
摘要 PURPOSE: A SAW(Surface Acoustic Wave) device having a hermetically sealed SAW chip and a fabricating method thereof are provided to miniaturize largely the SAW device by reducing a cavity as soon as possible. CONSTITUTION: A SAW device includes a piezoelectric substrate and a base substrate. Comb-like electrodes(13), first electrode pads(14) connected thereto, and a first film are formed on a first surface of the piezoelectric substrate(11A). The first film is located so as to surround the comb-like electrodes. Second electrode pads joined to the first pads and a second film joined to the first film are formed on a second surface of the base substrate(2A). The first and second films are joined by a surface activation process defining a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.
申请公布号 KR20040086189(A) 申请公布日期 2004.10.08
申请号 KR20040019611 申请日期 2004.03.23
申请人 FUJITSU LIMITED;FUJITSU MEDIA DEVICES LIMITED 发明人 KAWACHI OSAMU;IKATA OSAMU;UEDA MASANORI;WARASHINA SUGURU
分类号 H03H9/25;H03H3/08;(IPC1-7):H03H9/25 主分类号 H03H9/25
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