发明名称 |
SAW DEVICE HAVING HERMETICALLY SEALED SAW CHIP AND FABRICATING METHOD THEREOF |
摘要 |
PURPOSE: A SAW(Surface Acoustic Wave) device having a hermetically sealed SAW chip and a fabricating method thereof are provided to miniaturize largely the SAW device by reducing a cavity as soon as possible. CONSTITUTION: A SAW device includes a piezoelectric substrate and a base substrate. Comb-like electrodes(13), first electrode pads(14) connected thereto, and a first film are formed on a first surface of the piezoelectric substrate(11A). The first film is located so as to surround the comb-like electrodes. Second electrode pads joined to the first pads and a second film joined to the first film are formed on a second surface of the base substrate(2A). The first and second films are joined by a surface activation process defining a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed. |
申请公布号 |
KR20040086189(A) |
申请公布日期 |
2004.10.08 |
申请号 |
KR20040019611 |
申请日期 |
2004.03.23 |
申请人 |
FUJITSU LIMITED;FUJITSU MEDIA DEVICES LIMITED |
发明人 |
KAWACHI OSAMU;IKATA OSAMU;UEDA MASANORI;WARASHINA SUGURU |
分类号 |
H03H9/25;H03H3/08;(IPC1-7):H03H9/25 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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