| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high frequency module preventing degradation in an input-output isolation property due to reduction of a module in size. <P>SOLUTION: A high frequency module 200 is formed by combining a surface acoustic wave filter 210 constituted of a plurality of electrodes, an input-side semiconductor switch 220 and an output-side semiconductor switch 230, and the high frequency module 200 is equipped with: a first ground terminal 240 grounding an electrode, among the electrodes of the surface acoustic wave filter, to be connected to the input-side semiconductor switch; a second ground terminal 250 grounding an electrode, among the electrodes of the surface acoustic wave filter, to be connected to the output-side semiconductor switch; a third ground terminal 260 grounding the input-side semiconductor switch; and a fourth ground terminal 270 grounding the output-side semiconductor switch, the first to fourth ground terminals being independent of one another. Even if an input-output distance is reduced, since the first to fourth ground terminals are provided independently, the isolation property can be prevented from degrading. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
