| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation member in which although a substrate thereof is formed of a metal-containing material, molten solder is less prone to climb up the side of the substrate during connection to another member, thus making it possible to suppress short-circuit of a semiconductor laser and to inhibit a luminous flux of laser light emitted from an emission surface of a semiconductor laser from being blocked, and to provide a semiconductor device using the same. <P>SOLUTION: In the heat dissipation member 1, wettability against solder is imparted to an another member connection surface 6 of the substrate 7, and a solder block layer 14 for blocking the flow of the solder is formed on at least one of a region close to the another member connection surface 6 on a side 13 and a region close to the side 13 on the another member connection surface 6. In the semiconductor device, a semiconductor element is connected to an element connection surface via an element connection layer composed of solder, and another member is connected to the another member connection surface via an another member connection layer composed of solder having a melting point lower than that of the solder for forming the element forming layer. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
