| 发明名称 | Wound treatment employing antimicrobial composition | ||
| 摘要 | A process for reducing bacterial colonization in or around the area of a wound includes applying to the area a gel that includes at least one PEG and an aqueous composition which has a pH of from 2 to 4, a total solute concentration of from 1.8 to 4.0 Osm/L, and from 0.9 to 1.7 g/L of at least one cationic surfactant. The aqueous composition can include a buffer system that includes an organic acid and a salt of an organic acid. The gel is effective even when free of materials having antimicrobial properties other than those provided by the aqueous composition, such as sporicides, antifungals and antibiotics. | ||
| 申请公布号 | US9427417(B2) | 申请公布日期 | 2016.08.30 |
| 申请号 | US201615075147 | 申请日期 | 2016.03.19 |
| 申请人 | Next Science, LLC | 发明人 | Myntti Matthew Franco |
| 分类号 | A01N25/02;A01N25/08;A61K31/14;A61K47/34;A61K47/12 | 主分类号 | A01N25/02 |
| 代理机构 | Zollinger & Burleson Ltd. | 代理人 | Zollinger & Burleson Ltd. |
| 主权项 | 1. A process for reducing bacterial colonization in or around the area of a wound, said process comprising applying to said area a gel that comprises at least one PEG and an aqueous composition having a pH of from 2 to 4, a total solute concentration of from 1.8 to 4.0 Osm/L, and from 0.9 to 1.7 g/L of at least one cationic surfactant, said gel being free of sporicides, antifungals and antibiotics. | ||
| 地址 | Jacksonville FL US | ||