发明名称 HEATING ELEMENT, FIXING DEVICE AND IMAGE FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable heating element in which a crack is not generated because an adhesive well matches with a substrate and/or a base material of a temperature sensor and peeling is not generated because initial adhesive strength is large enough, by regulating the most appropriate percentage content range of a filler, a fixing device using it and an image forming device. SOLUTION: A slender resistance heating element is adhered to an electrically insulated slender substrate along its longitudinal direction, a temperature sensor 5 mounted on a base material is connected to a conductive material pattern formed on the substrate at a position where heat from the resistance heating element can be sensed, and in addition, adhesive 9 in polyamide group having equivalent or higher thermal conductivity, smaller coefficient of thermal expansion, to the material used in the substrate 1 and/or the base material, or a filler containing the same material for 76±1 wt.%, is applied between the temperature sensor 5 and the substrate 1. If thermal conductivity of the adhesive approaches enough to the material used the substrate 1 and/or the base material, its coefficient of thermal expansion becomes equivalent to it, or a filler of the same material is used, a crack or peeling is not generated in the adhesive.
申请公布号 JPH11251042(A) 申请公布日期 1999.09.17
申请号 JP19980064085 申请日期 1998.02.28
申请人 TOSHIBA LIGHTING & TECHNOLOGY CORP 发明人 SASAKI IKUE
分类号 G03G15/20;H05B3/16;H05B3/20;(IPC1-7):H05B3/20 主分类号 G03G15/20
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