| 摘要 |
PROBLEM TO BE SOLVED: To remove both comparatively large particles firmly adhering on a wafer and comparatively small particles deposited in a recess of the surface of the semiconductor wafer. SOLUTION: The wafer cleaning apparatus 10 is provided with a first cleaning head 12 having a first sponge brush 54 formed to be highly rigid so that it can remove the comparatively large particles 56 firmly adhering on the wafer 14, and a second cleaning head 13 having a second sponge brush 64 formed to be low-rigid so that it can remove the comparatively small particles 68 deposited in the recess of the wafer 14. In cleaning the wafer 14, the first cleaning head 12 is first driven to rotate the first sponge brush 54 in a state of abutting on the wafer 14. After that, the second cleaning head 13 is driven to rotate the second sponge brush 64 in a state of abutting on the wafer 14. COPYRIGHT: (C)2008,JPO&INPIT
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