发明名称 JUNCTION DEVICE AND JUNCTION METHOD
摘要 PROBLEM TO BE SOLVED: To prevent application of an excessive pressure onto a junction part.SOLUTION: A junction device 10 which performs liquid phase diffusion junction while sandwiching an amorphous material 4 between an end of a junction body 1 and ends of junction object bodies 2A, 2B. The junction device 10 comprises: a first heating body 11 for heating the junction body 1; second heating bodies 12A, 12B for heating the amorphous material 4; cooling pipes 13A, 13B through which a cooling medium is circulated thereby cooling the junction body 1; and a control unit 19 which circulates the cooling medium to the cooling pipe 13 when a pressure P which is applied onto junction parts 3A, 3B between the end of the junction body 1 and the ends of the junction object bodies 2A, 2B is higher than a first specified value P1.SELECTED DRAWING: Figure 1
申请公布号 JP2016159311(A) 申请公布日期 2016.09.05
申请号 JP20150038486 申请日期 2015.02.27
申请人 MITSUBISHI HITACHI POWER SYSTEMS LTD 发明人 HONDA TAKASHI;MATSUI MASAKAZU;SAKATA FUMITOSHI;MATSUMOTO SHINTARO
分类号 B23K20/00 主分类号 B23K20/00
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