Power module and method of packaging the same

摘要

Provided are a power module having an integrated power semiconductor and a method of packaging the same. The power module according to an aspect of the present invention includes a power semiconductor chip based on silicon and insulating substrates respectively disposed at both surfaces of the power semiconductor chip and including a metal pattern electrically and directly connected to the power semiconductor chip.

主权项

1. A power module comprising:
a power semiconductor chip based on silicon; an upper insulating substrate disposed on an upper surface of the power semiconductor chip; a pattern formed on a first surface of the upper insulating substrate, the pattern being electrically and directly connected to the power semiconductor chip; and a dielectric layer formed on a second surface of the upper insulating substrate, the second surface being opposite of the first surface.