发明名称 |
Polishing apparatus |
摘要 |
An apparatus has a polishing head for polishing an object such as a semiconductor wafer by using a polishing tape stretched between two guide rollers. The head can be rotated so as to change the angle of contact between the tape and the object and also undergo a reciprocating motion perpendicular to the direction of supply of the tape. For this purpose, the apparatus includes a first plate attached to the head and a second plate supported parallel to each other and in motion-communicating relationship by means of rods which are attached to the first plate and penetrate the second plate. The second plate is attached to the rotary shaft of a direct drive motor for causing oscillatory angular motion. This rotary shaft is tubular and an inner shaft for causing the oscillatory motion passes slidably therethrough.
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申请公布号 |
US5509850(A) |
申请公布日期 |
1996.04.23 |
申请号 |
US19940265281 |
申请日期 |
1994.06.24 |
申请人 |
NIHON MICRO COATING CO., LTD. |
发明人 |
MORIOKA, IZURU;YUI, KIYOSHI |
分类号 |
B24B9/00;B24B9/06;B24B21/00;B24B35/00;(IPC1-7):B24B9/00;B24B5/00 |
主分类号 |
B24B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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