MANUFACTURE OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board wherein a plating film is formed only inside a through hole of a laminate and plating is enabled without forming a plating film on the surface of the laminate. SOLUTION: At the position corresponding to a through hole 13 where a plating film 16 is to be formed, a penetrating hole 15 wherein the form of a surface coming into contact with a laminate 10 is the same form as the surface form of the through hole 13 is formed on the surface coming into contact with the laminate 10. At the position corresponding to the laminate 10 surface except the through hole 13 where the plating film 16 is to be formed, a shielding part 25 capable of coming closely into contact with the laminate 10 surface is formed on the surface coming into contact with the laminate 10. A process clamping the laminate 10 with a detachable clamping jig 14, a process forming a plating film 16 in the through hole 13 of the laminate 10 clamped with the clamping jig 14, and a process mechanically isolating the laminate 10 from the jig 14 are included.