| 摘要 |
PROBLEM TO BE SOLVED: To obtain both an epoxy resin composition excellent in moldability, providing a cured material having low hygroscopic properties, high heat resistance, high adhesivity to a different material and electric insulating properties and its cured material. SOLUTION: In this epoxy resin composition comprising an epoxy resin, a curing agent and a modifier as essential components, 100 pts.wt. of o the epoxy resin is compounded with 2-50 pts.wt. of an aromatic oligomer as the modifier which is obtained by subjecting monomers composed of an indene as a main component to cationic polymerization and has <=50μS/cm electric conductivity of extraction water.
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