发明名称 Electronic device packaging
摘要 The present invention discloses a large form factor media enclosure structure configured to removably retain a smaller form factor device therein. The large form factor media enclosure structure includes a first flexible retainer, and a second retainer oppositely disposed from said first retainer. A catch paw is disposed along the first retainer, for frictionally engaging the smaller form factor device.
申请公布号 US6839239(B1) 申请公布日期 2005.01.04
申请号 US20020198218 申请日期 2002.07.17
申请人 3COM CORPORATION 发明人 LEE SEANG WEE
分类号 H05K5/02;(IPC1-7):H05K5/06 主分类号 H05K5/02
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