| 摘要 |
An improved cathode moving apparatus for semiconductor device fabrication equipment is provided to prevent air leakage and a movement error in a cylinder by not using an air cylinder method. An improved cathode moving apparatus for semiconductor device fabrication equipment includes a cathode(7) moved upwardly and downwardly within a process chamber(10), a motor shaft(110) connected to an up/down moving main shaft(6) of the cathode, and a motor(100) for rotating the motor shaft in a positive direction or a reverse direction according to a direction control signal. The main shaft and the motor shaft are connected to each other by using a lead screw combination method. The main shaft is sealed with the process chamber and is moved. The semiconductor device fabrication equipment is formed with plasma etch equipment.
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