| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for dry etching that can improve etching efficiency at the time when dry etching of resist is performed, can improve working efficiency by shortening an etching time, and can prevent the damage of a processing object and the deterioration of its properties. Ž<P>SOLUTION: In a dry etching apparatus equipped with a chamber 10 that etches the processing object, shielding plates 30 consisting of Ta, Ti or an alloy containing Ta or Ti are arranged in the chamber. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
