DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME

摘要

A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.

主权项

1. A testing head comprising:
a probe card printed circuit board (PCB) having a first planar surface extending an entire length of the probe card PCB, a stiffener coupled to and reinforcing the probe card printed circuit board, wherein the probe card printed circuit board and the stiffener each comprise portions that are separated from one another, the stiffener having a second planar surface facing the first planar surface and extending from a first end of the probe card PCB to an opposite end of the probe card PCB, a plurality of individual detachable backer units extending from the first planar surface to the second planar surface, and a plurality of probing tips extending from a distal end of the testing head.