| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit module whose density is high and which can realize an easy mounting operation, by a constitution wherein a plurality of stacked and arranged printed wiring boards are connected electrically by metal bumps, and electronic components are resin-sealed and mounted between the boards. SOLUTION: A desired electronic circuit is formed, via a via hole 21b and a through hole 21c, on a first printed wiring board 21, and a recessed component housing part 21d is formed on one face faced with a second printed wiring board 22. An electronic component 24 is housed in the component housing part 21d via respective metal bumps 25 so as to be connected electrically to the electronic circuit. On the other hand, a desired electronic circuit is formed, via a via hole 22b and a through hole 22c, on the second printed wiring board 22, and a recessed component housing part 21d is formed on one face faced with the first printed wiring board 21. An electronic component 24 is mounted in the component housing part 21d so as to be connected to the electronic circuit via respective metal bumps 25. Then, connecting lands 21a, 22a on both boards 21, 22 are connected via respective metal bumps 26, a resin 29 is sealed between them, and both boards are pasted and stacked.</p> |
