| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has excellent mold releasability, when molded, and is used for sealing semiconductors, and to provide a semiconductor device which has excellent reliability such as excellent soldering resistance and can correspond to the rise of a mounting temperature, when a semiconductor device is mounted. SOLUTION: This epoxy resin composition for sealing semiconductors is characterized by containing (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler, (D) a curing accelerator, and (E) a compound represented by general formula (1) as essential components. COPYRIGHT: (C)2005,JPO&NCIPI
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