| 摘要 |
Provided is a photosensitive resin composition having superior chemical resistance while maintaining high sensitivity. The photosensitive resin composition contains: (A) a polymer component containing a polymer satisfying the belowmentioned (1) and/or (2), (1) being a polymer having (a1) a constituent unit having a residue such that an acid group is protected by an acid-labile group and (a2) a constituent unit having a cross-linkable group, and (2) being (a1) a polymer having a constituent unit having a residue such that an acid group is protected by an acid-labile group and (a2) a polymer having a constituent unit having a cross-linkable group; (B) a photoacid generator; (C) a compound represented by general formula (c-1); and (D) a solvent. (In the formula: ring A represents an aromatic ring having one nitrogen atom, sulfur atom, or oxygen atom in the ring; X represents a hydrogen atom, an alkyl group, or an aryl group; Y represents a hydroxyl group, a carboxyl group, an alkylcarbonyl group, an arylcarbonyl group, an alkyloxycarbonyl group, an alkoxy group, an aryloxy group, a mercapto group, or an amino group; m represents an integer that is at least 1; and n represents an integer that is at least 1.) |
