Stack of integrated-circuit chips and electronic device

摘要

A stack of chips is formed by a first integrated-circuit chip and a second integrated-circuit chip. The chips have opposing faces which are separated from each other by an interposed spacer. The spacer is fastened by adhesion to only one of the opposing faces. The opposing faces are fastened to each other by a local adhesive which is separate from spacer.

主权项

1. A stack of integrated-circuit chips, comprising:
a first and a second integrated-circuit chip having opposing first and second faces, respectively, located at a distance from one another; a spacer interposed between a part of a peripheral region of the second face of the second chip and the first face of the first chip, the spacer being vertically aligned with the first face of the first chip and the part of the peripheral region of the second face of the second chip; a first adhesive attaching the spacer only to one of the first and second faces; and a second adhesive interposed between a central region of the second face of the second chip and the first face of the first chip in order to fasten the first and second integrated-circuit chips to one another; wherein the second adhesive is separated from and not in contact with the spacer.