发明名称 Coating apparatus
摘要 A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.
申请公布号 US9401291(B2) 申请公布日期 2016.07.26
申请号 US201414525502 申请日期 2014.10.28
申请人 Tokyo Electron Limited 发明人 Mimura Yuji;Maki Tetsuya;Tsuruta Shigeto;Oonishi Tatsumi;Ikemoto Daisuke;Masunaga Takahiro
分类号 B05B12/02;B05B1/04;B05C5/02;B05C11/10;H01L21/67 主分类号 B05B12/02
代理机构 Posz Law Group, PLC 代理人 Posz Law Group, PLC
主权项 1. A coating apparatus for applying a coating material to a substrate, comprising: a slit nozzle comprising a retention chamber that retains the coating material; a moving mechanism that relatively moves the slit nozzle with respect to the substrate, the retention chamber is adapted to contain a volume of the coating material that decreases throughout application of the coating material; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that is configured to control the moving mechanism and the pressure regulation unit to relatively move the slit nozzle evenly in a moving direction to scan with respect to the substrate in the moving direction from a coating start position on the substrate through a middle zone to a coating end position on the substrate while constantly increasing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein an entire coating length of the substrate consists of three zones which are a start zone, the middle zone, and an end zone; wherein the control unit is further configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber while the slit nozzle is relatively moved in the moving direction throughout the start zone which includes the coating start position and throughout the end zone which includes the coating end position becomes slower than a change in the pressure inside the retention chamber while the slit nozzle is relatively moved in the moving direction throughout the middle zone, and to control the pressure regulation unit so that the pressure inside the retention chamber at the coating start position starts with a fixed pressure and the pressure inside the retention chamber is constantly increased while the slit nozzle is moved from the coating start position to the coating end position, a slope is defined as pressure inside the retention chamber vs distance moved in the moving direction, the slope correspondingly to the middle zone is different than the slope corresponding to the start zone and the end zone; and the slope corresponding to the start zone and the slope corresponding to the end zone are less than the slope corresponding to the middle zone, the start zone has a first predetermined length in the moving direction from the coating start position to an end point of the start zone, the end point of the start zone is closer than the coating start position to the end zone, the end zone has a second predetermined length in the moving direction from a start point of the end zone to the coating end position, the start point of the end zone is closer than the coating end position to the start zone, the middle zone is from the end point of the start zone to the start point of the end zone, the coating start position of the start zone is a first end of the circular substrate, the coating end position of the end zone is a second end of the circular substrate opposite to the first end, the start zone, the middle zone, and the end zone cover the entire diameter of the circular substrate.
地址 Tokyo JP