| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus capable of achieving both of sufficient heat radiation of a solid-state imaging device and heat radiation of a circuit board.SOLUTION: The whole main surface of a solid-state imaging device 101 is tightly joined and electrically connected to a first main surface 103a of a circuit board 103 and LSI 104 and chip components 105 also are mounted on the first main surface 103a of the circuit board 103 which is the same joining surface on which the solid-state imaging device 101 is joined. A heat radiation fin 106 for the solid-state imaging device is joined to a position on a second main surface 103b of the circuit board 103 which is the opposite side facing an area on the circuit board 103 to which the solid-state imaging device 101 is joined over an area wider than an effective pixel area of the solid-state imaging device 101. A heat radiation fin 107 for mounted components is joined to a position on a second main surface 103b of the circuit board 103 which is the opposite side facing the area on the circuit board 103 on which the LSI 104 and the chip components 105 are mounted over an area of the same width area as the mounting area of the LSI 104 and the chip components 105 or wider than the mounting area.SELECTED DRAWING: Figure 2 |
