| 摘要 |
<p>PURPOSE:To prevent a wafer from being damaged and deformed due to a drop shock by a method wherein the lower edge part of the wafer is carried and held by a slope-shaped carrying and holding face which has been formed at a receiving stand part, which does not have any opening part and whose pressure-receiving area is wide. CONSTITUTION:When a wafer W is inserted between upper-part slits 41, 42 formed between adjacent ribs 39, 40, the lower edge part of the wafer W which has been dropped is carried and held by slope-shaped carrying and holding faces 35a, 36a at receiving stand parts 35, 36. Since the slope-shaped carrying and holding faces 35a, 36a do not have any opening part and their pressure- receiving area is wide, the damage and the deformation of the wafer W due to a drop shock are small. In addition, many wafers housed inside a basket 30 can be set at a desired width which is different form an insertion width formed between the adjacent ribs 39, 40 and adjacent positioning protrusions 47, 48.</p> |
