| 发明名称 |
SUPPORT FOR BONDING A WORKPIECE AND METHOD THEREOF |
| 摘要 |
The present invention provides a support for temporary bonding a workpiece such as a thick device wafer. The support comprises a carrier having a supporting surface and an isolation film. A first side of the isolation film is bonded to the supporting surface with a peeling strength of from 0.01 to 50.0 g/cm. The invention also provides a method of using the support to e.g. grind the workpiece in making thinned products such as thin silicon wafer, optical lens, thin LCD glass, and thin rock crystal wafer, among others. |
| 申请公布号 |
US2016167358(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201514797122 |
申请日期 |
2015.07.11 |
| 申请人 |
Tang Hao;Zhang Zhoujie |
发明人 |
Tang Hao;Zhang Zhoujie |
| 分类号 |
B32B38/10;B05D1/18;B32B37/14;B05D1/32;B05D1/00;B05D1/28;B05D1/02;B05D1/30 |
主分类号 |
B32B38/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A support for temporary bonding a workpiece comprising:
a carrier having a supporting surface, and an isolation film; wherein a first side of the isolation film is bonded to the supporting surface with a peeling strength P1 in the range of from 0.01 to 50.0 g/cm, as determined by ASTM D6862. |
| 地址 |
Chino Hills CA US |
