发明名称 CIRCUIT CONNECTION MATERIAL AND CONNECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a circuit connection material excellent in electrical connection even when a first circuit member and a second circuit member having a protective layer are connected and the circuit connection material is arranged to overlap with the protective layer of the second circuit member.SOLUTION: There is provided a circuit connection material having an anisotropic conductive layer containing conductive particles and being belt like, where the anisotropic conductive layer has a belt like thick film part and a belt like thin film part neighboring in a width direction of the circuit connection material and the average thickness of the thin film part is 40% o 60% to the average thickness of the thin film part.SELECTED DRAWING: Figure 3B
申请公布号 JP2016177917(A) 申请公布日期 2016.10.06
申请号 JP20150055620 申请日期 2015.03.19
申请人 DEXERIALS CORP 发明人 SATO SHINICHI
分类号 H01B5/16;C09J7/00;G09F9/00;H01R11/01;H01R43/00 主分类号 H01B5/16
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