发明名称 Emulsifying epoxy resin composition and curable composition
摘要 An emulsifying epoxy resin composition having excellent emulsifiability and storage stability, which comprises a specific epoxy resin (I), an emulsifiable epoxy compound (II) prepared by reacting an urethane compound (II-1), prepared by the reaction of a polyalkylene polyether polyol compound (II-1-1) having a number average molecular weight of 200 to 12,000 and an ethylene oxide content of 80% by weight or above with an excess amount of a polyisocyanate compound (II-1-2), with a specific epoxy compound (II-2) and an alkylphenol ethoxylate (II-3) having a number average molecular weight of 300 to 5,000 at a specific ratio, and water (III). A curable composition having a high cure rate and the cured product obtained these from having excellent film strength, water resistance and so on, which comprises the above-described emulsifiable epoxy resin composition and an active organic amino compound (IV) is also within the scope of the present invention.
申请公布号 US5391596(A) 申请公布日期 1995.02.21
申请号 US19930061623 申请日期 1993.05.13
申请人 ASAHI DENKA KOGYO K.K.;A.C.R. CO., LTD. 发明人 MUTO, KIYOSHI;SUZUKI, HIROSHI
分类号 C08G18/58;C08G18/10;C08G59/14;C08G59/20;C08G59/28;C08G59/40;C08G59/50;C08G59/62;C08L63/00;C08L75/08;C09D163/00;(IPC1-7):C08K3/20;C08L63/02 主分类号 C08G18/58
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