| 摘要 |
PURPOSE: To obtain a composition containing an imide bond-containing organosiloxane oligomer, having good coating adhesion and storage stability, and suitable for electronic materials such as semiconductor buffer coats, interlayer insulating films and passivation films. CONSTITUTION: This composition contains an organosiloxane oligomer having imide bonds of the formula and preferably containing the thermal reaction product of (A) an aminoalkylalkoxysilane, an aminoarylalkoxysilane and their hydrolysis (condensation) products (e.g. γ-aminopropyltriethoxysilane) with (B) a polybasic carboxylic acid having an acid anhydride-forming ability (e.g. pyromellitic acid). The composition is especially suitable for forming protecting films for transparent substrates in liquid crystal elements, color filters, etc. |
