| 摘要 |
<p>The invention relates to a process for galvanic copper plating substrates, by using anodes insoluble in acid copper baths, with separate supply of used copper ions, consisting in that, the greatest part of the copper ions are supplied directly, as copper carbonate and/or basic copper carbonate, without the aid of diafragms and auxiliary electrodes, in a separate bath functioning in a by-pass system in relation to the working electrode, in the same tank there also being separated the gaseous CO2 released.</p> |
