| 摘要 |
PROBLEM TO BE SOLVED: To realize a light, thin and small multi-terminal package by forming a die pad and inner leads from a lead frame and supporting pads for fixing bump conductors by the inner lead top ends. SOLUTION: An IC chip 1 is mounted on die pad 20 of a lead frame. The die pad 20 is connected to the top ends 2a of inner leads 2b of the lead frame by bonding wires 3. The chip 1, pads 20, inner leads 2b, lead pads 2a and bonding wires 3 are sealed en bloc with a specified resin to form a sealed block 4. Lead pads 2a for fixing solder balls 6 to be bump conductors are supported by the top ends of the inner leads 2b. Thus it is possible to realize a light, thin and small multi-terminal package. |
