| 摘要 |
The memory module includes a plurality of memory units, each of which include a memory substrate, at least a memory chip having a predetermined memory capacity mounted on the memory substrate, and a conductive terminal provided at a lower edge portion of the memory substrate to electrically connect with the memory chip. An assembling arrangement includes a first joint provided at a side edge of each of the memory substrates and a second joint provided at an opposed side edge of each of the memory substrates, wherein the first joint of the memory unit is detachably engaged with the second joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner, such that the memory units form the memory module. |
