发明名称 Method of forming a thermally conductive article using metal injection molding material with high and low aspect ratio filler
摘要 The present invention discloses a conductive injection molding composition. The thermally conductive composition includes a metallic base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. In addition, an alternative embodiment of the composition mixture includes a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.
申请公布号 US6899160(B2) 申请公布日期 2005.05.31
申请号 US20030605041 申请日期 2003.09.03
申请人 COOL OPTIONS, INC. 发明人 MCCULLOUGH KEVIN A.
分类号 B22D23/06;B22D25/06;B32B5/00;C04B35/00;C22C47/14;C22C49/02;C22C49/14;(IPC1-7):C22C47/14 主分类号 B22D23/06
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