| 摘要 |
A compact replaceable temperature control module (16) for use with semiconductor manufacturing equipment and a controller to control an operating temperature of an internal surface in a process chamber of the equipment. The control module includes a housing (36) having a size which permits the housing to be placed in close proximity to the equipment. A circulatory system (38) is carried by the housing and adapted to couple to the equipment for creating a closed loop system with the equipment for regulating the operating temperature of the internal surface in the process chamber. The circulatory system includes a thermal electric heat exchanger (51) provided with a hollow core element (52) having a temperature different than the unknown temperature and a pump (286) for causing the liquid to flow through the hollow core element.
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