| 发明名称 | Semiconductor device and method of manufacturing the same | ||
| 摘要 | A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening. | ||
| 申请公布号 | US9379155(B2) | 申请公布日期 | 2016.06.28 |
| 申请号 | US201514689906 | 申请日期 | 2015.04.17 |
| 申请人 | Sony Corporation | 发明人 | Nabe Yoshihiro;Asami Hiroshi;Takaoka Yuji;Harada Yoshimichi |
| 分类号 | H01L23/02;H01L27/146;H01L23/48;H01L23/00;H01L21/768;H01L31/0224 | 主分类号 | H01L23/02 |
| 代理机构 | Sheridan Ross P.C. | 代理人 | Sheridan Ross P.C. |
| 主权项 | 1. A device comprising: a semiconductor substrate having oppositely facing first and second surfaces; a pad electrode; a first opening in the semiconductor substrate extending from the second surface toward the pad electrode; a second opening in the semiconductor substrate extending from the first opening, the first opening having a diameter larger than that of the second opening; an insulating layer in at least the first opening; and conductive material in the first and second openings and electrically connected to the pad electrode. | ||
| 地址 | Tokyo JP | ||