| 摘要 |
<p>PURPOSE:To prevent circuit mismatching between circuits in the inside and outside of a mold in terms of a high frequency band of an inductance of a metal lead which connectes the inside to the outside of the mold. CONSTITUTION:There are provided a first metal material 2 which mounts a semiconductor chip 1 and a second metal material 3 connected to an external circuit. The second metal material 3 is used as a central conductor. As for the shape of the first metal material 2, it is laid out so as to sandwitch the central conductor, thereby constituting a transmission line. The shape dimensions of the first metal material 2 and the second metal material 3 of the transmission line is decided so that the semiconductor chip 1 may match with the peripheral circuit. This construction makes it possible to prevent mismatching of inductance components of the metal leads which connect the inside of the mold to the outside of a mold.</p> |
