| 摘要 |
The device has a component (20) for cutting the chips and a further component (10) for taking hold of the chips in order to transfer them to the deposit location. The cutting component has a static support (26,27) for the chips during the cutting process and a cutting plunger (23), which at the end of its cutting stroke surrounds the chips. The securing component for each chip is within the cutting plunger and is provided with one or more suction cups for securing the chips and their transfer to one or more deposit locations where they are released by increasing the pressure in the suction cups. The suction cups are connected to conduits, which are in turn connected via valves with a vacuum source or an excess pressure source. |
