发明名称 Interlayer dielectric for charge loss improvement
摘要 A method of manufacturing a memory device includes forming a first dielectric layer over a substrate and forming a charge storage element over the first dielectric layer. The method also includes forming a second dielectric layer over the charge storage element and forming a control gate over the second dielectric layer. The method further includes depositing an interlayer dielectric over the control gate at a high temperature.
申请公布号 US7300886(B1) 申请公布日期 2007.11.27
申请号 US20050147208 申请日期 2005.06.08
申请人 SPANSION LLC;ADVANCED MICRO DEVICES, INC. 发明人 NGO MINH VAN;CHENG NING;LI WENMEI;HUI ANGELA T.;GAO PEI-YUAN;HUERTAS ROBERT A.
分类号 H01L21/31 主分类号 H01L21/31
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