| 摘要 |
A positive type photosensitive polyimide composition containing a photobase generator is provided to obtain a positive type photosensitive polyimide capable of minimizing generation of contaminants and preventing a drop in resolution by using a reaction development patterning process. A positive type photosensitive polyimide composition comprises: a soluble polyimide represented by the following formula 1; polyamic acid represented by the following formula 2; and a photobase generator having an oxime-urethane group represented by the following formula 3. In the formulae, n is an integer of 3-10,000; p is 0 or 1; each of P and Q represents at least one substituent selected from the group consisting of phenyl, naphthyl, pentadienyl, halogen, C1-C4 alkyl-substituted phenyl, naphthyl and pentadienyl; and B is a leaving group including a C1-C20 aromatic or aliphatic hydrocarbon compound.
|
