| 摘要 |
PROBLEM TO BE SOLVED: To reduce work for removing an unnecessary metal layer when forming a wiring or an interlayer connection via on a substrate by electroplating. SOLUTION: An additive is added to a plating solution for use in electroplating. The additive is characterized in that, although it has a function of suppressing plating reaction, the function of suppressing plating reaction is decreased with the progress of plating reaction. The additive is also characterized in that, although it has a function of increasing a deposition overvoltage of metal, it decreases the deposition overvoltage of metal with the progress of reaction. The metal can hereby be deposited selectively onto a groove and a recessed part each formed in a substrate. When forming the wiring or the interlayer connection via on the substrate, the groove and the recessed part each having prescribed surface roughness are formed in the substrate. COPYRIGHT: (C)2009,JPO&INPIT |
