发明名称 COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve productivity when mounting components on a substrate, and to make easy production control when remounting components by eliminating stopping whole production line by partial failure. <P>SOLUTION: Component pick-up heads 43a and 43b pick up components from component supply devices 45a and 45b to mount them on substrates Sa and Sb carried therein by two substrate carriers 10a and 10b. Component transfer devices at once or alternatively mounting two pieces of substrates carried by two substrate transfer devices. In the case of the two component pick-up heads, the component pick-up head for mounting a component on a substrate mounts the component to another substrate with another component pick-up head when a substrate is in transportation or the width of a component transfer device is in changing. Any one of the substrate transfer devices is used as a bypass conveyor or a return conveyor. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009135554(A) 申请公布日期 2009.06.18
申请号 JP20090073276 申请日期 2009.03.25
申请人 FUJI MACH MFG CO LTD 发明人 SHIMIZU KOJI;TERUI SEIICHI
分类号 H05K13/04;H05K13/02 主分类号 H05K13/04
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