发明名称 |
A LEAD FRAME AND THE METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE COMPRISING THE SAME |
摘要 |
Provided is a method for manufacturing a lead frame and a semiconductor package having a semiconductor chip for connecting to an outer board and having a base metal layer formed of iron and nickel as main elements. The method includes preparing the base metal layer of a lead frame, forming one or more plating layers on the base metal layer, mounting the semiconductor chip on the lead frame, molding the semiconductor chip and at least a portion of the lead frame, bending the lead frame to form the lead frame in a predetermined shape, and heat-treating the lead frame for forming a diffusion layer in order to protect the lead frame from corrosion. |
申请公布号 |
KR20050083325(A) |
申请公布日期 |
2005.08.26 |
申请号 |
KR20040011819 |
申请日期 |
2004.02.23 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
LEE, SANG HUN;PAEK, SUNG KWAN;PARK, SE CHUEL |
分类号 |
H01L21/44;H01L21/48;H01L21/60;H01L23/495 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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