| 摘要 |
The invention relates to an optoelectronic component (16) comprising: - a moulding (5), - a semiconductor chip (2), - an electrical via (3), which represents an electrically conducting connection through the moulding, wherein the via and the semiconductor chip are embedded next to one another in the moulding, wherein an electrical contact (13) of the semiconductor chip is formed on an upper side of the semiconductor chip, wherein a first contact area (7) of the via is formed on the underside of the moulding, wherein a second contact area (9) of the via is formed on the upper side of the moulding, wherein the second contact area is connected in an electrically conducting manner to the electrical contact of the semiconductor chip, wherein the via is formed in such a way that, at least in a portion between the first contact area and the second contact area, a moulding is arranged on a straight line between the first contact area and the second contact area. The invention also relates to a method for producing the optoelectronic component. |
