发明名称 |
Selectively degrading current resistance of field effect transistor devices |
摘要 |
A method includes selectively degrading a current capacity of a first finned-field-effect-transistor (finFET) relative to a second finFET by forming a material on a fin of the first finFET to increase a current resistance of the first finFET. The second finFET is electrically connected to the first finFET in a circuit such that a current flow through the second finFET is a multiple of a current flow through the first finFET. |
申请公布号 |
US9373550(B2) |
申请公布日期 |
2016.06.21 |
申请号 |
US201414578778 |
申请日期 |
2014.12.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Basker Veeraraghavan S.;Leobandung Effendi;Wendel Dieter;Yamashita Tenko |
分类号 |
H01L21/8238;H01L27/092;H01L21/8234;H01L27/088 |
主分类号 |
H01L21/8238 |
代理机构 |
Cantor Colburn LLP |
代理人 |
Cantor Colburn LLP ;Alexanian Vazken |
主权项 |
1. A method for selectively degrading a current capacity of a finned-field-effect-transistor (finFET), comprising:
forming a first finFET and a second finFET on a substrate; implanting the second finFET with an implantation material selected to alter an ability of a fin of the second finFET to grow an epitaxial layer; and epitaxially growing a first epitaxial layer on a fin of the first finFET and a second epitaxial layer on a fin of the second finFET, the first epitaxial layer having a height different than the second epitaxial layer due to the implantation material in the fin of the second finFET. |
地址 |
Armonk NY US |