Temperature compensated crystal oscillator

摘要

The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

主权项

1. A temperature compensated crystal oscillator comprising:
a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has an opening, which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region which is surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region which is surrounded by the mounting frame, a lid which is joined to the upper surface of the frame, an interconnect pattern which is electrically connected to the electrode pad and is provided on the upper surface of the substrate, and a via conductor which is electrically connected to the interconnect pattern, which penetrates the substrate from the upper surface of the substrate to the lower surface of the substrate, which is provided at a position where the via conductor overlaps the mounting frame and is between the joining pads when viewed on a plane, and which is not electrically connected to conductors on the upper surface of the mounting frame including the joining pads.