USE OF REACTION CURING ADHESIVE COMPONENTS IN HOT-MELT ADHESIVES FOR CARDBOARD PACKAGING

摘要

The invention relates to the use of radiation and/or moisture curing reactive adhesive components in solvent-free hot-melt adhesives for the simpler and safer closure of cardboard packaging and folding cartons such that the packaging seals are highly heat resistant. Especially suitable are adhesive components presenting multistage reaction curing which in a first reaction stage undergo a free-radical and/or cationic reaction and in at least one subsequent reaction stage react under the effect of moisture.