| 摘要 |
<p>A rotation holding device for holding and rotating a disk member (rotated body) such as a semiconductor wafer, and a semiconductor substrate processing device forming a circuit wiring by filling circuit pattern grooves and/or holes formed in a semiconductor substrate with metal plating film and removing the metal plating film other than that on the filled portions; comprising a rotating member rotating about the rotating axis thereof and holding members disposed along the same circular direction about the rotating axis of the rotating member and revolving according to the rotation of the rotating members.</p> |
