MANUFACTURING METHOD FOR A CARD AND CARD OBTAINED BY SAID METHOD

摘要

The method for manufacturing a dual interface card comprises at least the following step: - collocating multiple card support sheets one onto the other, some of these sheets showing holes, in order to form a recess adapted to receive the dual interface module, one of the sheets supporting the antenna having solid metallic contact pads at least partially freely accessible in the recess - depositing a conductive adhesive onto the contact pads - positioning the dual interface module in the recess such that the pads of the module are contacting the conductive adhesive - executing one single lamination step of the sheets with the module in orde r to: - laminate the multiple layers together in order to form the card body - embed the dual interface module in the recess and - achieve the curing of the isotropic conductive adhesive and the permanent electrical contact between the antenna and the dual interface module.