发明名称 SOLDERING TIP, SOLDERING IRON, AND SOLDERING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a soldering system for melting a solder to form a joint between a first workpiece and a second workpiece. SOLUTION: The system may includes an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009131898(A) 申请公布日期 2009.06.18
申请号 JP20080303319 申请日期 2008.11.28
申请人 NORDSON CORP 发明人 MICHAEL S FORTI;KEVIN W GAUGLER;VIVARI JOHN A JR;WHEELER KEITH
分类号 B23K3/02;B23K1/002;B23K3/03;B23K3/06;B23K101/42;H05K3/34 主分类号 B23K3/02
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