Touch panel module and manufacturing method thereof

摘要

A touch panel module includes an integrated panel and a casing. The integrated panel defines a transparent region and a non-transparent region around the transparent region. The integrated panel has a covering substrate, a decorating layer disposed on the inner surface of the covering substrate and arranged in the non-transparent region, a sensing electrode layer disposed on the inner surface of the covering substrate and arranged in the transparent region, a circuit layer disposed on the decorating layer and electrically connected to the sensing electrode layer, and a protective layer at least covering par of the decorating layer and part of the circuit layer. The casing is formed by injection molding, wherein one portion of the casing is arranged in the non-transparent region and formed on the protective layer, and another portion of the casing covers a circumferential lateral edge of the integrated panel.

主权项

1. A touch panel module, comprising:
an integrated panel having a transparent region and a non-transparent region defined around the transparent region, the integrated panel comprising: a covering substrate having an inner surface and an opposite outer surface; a decorating layer disposed on the inner surface of the covering substrate and arranged in the non-transparent region; a sensing electrode layer disposed on the inner surface of the covering substrate and arranged in the transparent region; a circuit layer disposed on the decorating layer and electrically connected to the sensing electrode layer; and a protective layer at least directly covering part of the decorating layer and part of the circuit layer, and a casing formed by injection molding, wherein one portion of the casing is arranged in the non-transparent region and formed on the protective layer, and another portion of the casing covers a circumferential lateral edge of the integrated panel; and wherein the casing has an outer end surface connected to the outer surface of the covering substrate, and wherein the outer end surface of the casing and the outer surface of the covering substrate are arranged in a coplanar manner.