Interconnect structure for CIS flip-chip bonding and methods for forming the same

摘要

A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity.

主权项

1. A method comprising:
forming a stud bump on a surface of an image sensor chip, wherein the stud bump comprises a bump region, and a tail region connected to the bump region, and wherein the tail region is short enough to support itself against gravity; and bonding a substrate to the image sensor chip through the stud bump, wherein the substrate comprises:
a first portion overlapping a portion of the image sensor chip, wherein the first portion of the substrate comprises an electrical connector in contact with the tail region of the stud bump; anda second portion connected to the first portion, wherein the second portion extends along sidewalls of the image sensor chip and comprises a lower end level with a bottom surface of the image sensor chip.