Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

摘要

A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.

主权项

1. A compound carrier board structure of Flip-Chip Chip-Scale Package, comprising:
a carrier board having a plurality of first and second contact points, at an upper surface thereof and the second contact point located around the first contact point; and a baseplate having a plurality of electrical conductive bodies passing therethrough and a flip region with a through-opening, and the electrical conductive bodies having upper and lower ends respectively exposed at an upper surface and lower surface of the baseplate and electrically connected to lower surfaces of a plurality of first electrode pads and upper surfaces of a plurality of second electrode pads; a Non-conductive Film having an upper surface bonded to the lower surface of the baseplate; the second electrode pad having a lower surface corresponding to a position of the second contact point electronically connected to the second contact point and the first contact point corresponding to a position of the flip region located in the flip region; the Non-Conductive film having a lower surface bonded to the upper surface of the carrier board; wherein the baseplate is formed by a combination of a first layer and a second layer; and wherein the electrical conductive body has an upper conductor in a blind-hole shape, a middle conductor in a buried-hole shape and a lower conductor in a blind-hole shape; both of the upper conductor and middle conductor are located at the first layer and the lower conductor is located at the second layer.