| 摘要 |
PROBLEM TO BE SOLVED: To provide an encapsulant sheet for solar cell module capable of suppressing occurrence of crack in a solar cell element caused by a bus bar, while having sufficient heat resistance.SOLUTION: In a TMA curve showing a relationship of a predetermined temperature range (°C) and the depth (μm) of a needle pushed into an encapsulant sheet, obtained by thermomechanical analysis (TMA) test, the slope P(push-in depth (μm) of the TMA curve/temperature (°C)) is obtained in the predetermined temperature range (°C), and the value P(P=100×(P/P)) of the ratio of P, i.e., the gradient at 80% of the thickness of the encapsulant sheet to P, i.e., the maximum value of the absolute value of the gradient P is 30% or less.SELECTED DRAWING: Figure 2 |
